Yong-Da Chiu

Filling mechanism in microvia metallization by copper electroplating

Wei‐Ping Dow, Ming-Yao Yen, Sian-Zong Liao et al. · Electrochimica Acta · 2008 · 129 citations

Engineering, Materials Engineering, Materials Science +14

Microvia Filling by Cu Electroplating Over a Au Seed Layer Modified by a Disulfide

Wei‐Ping Dow, Yong-Da Chiu, Ming-Yao Yen · Journal of The Electrochemical Society · 2009 · 96 citations

Natural Sciences, Materials Engineering, Materials Science +17

Accelerator Screening by Cyclic Voltammetry for Microvia Filling by Copper Electroplating

Yong-Da Chiu, Wei‐Ping Dow · Journal of The Electrochemical Society · 2013 · 85 citations

Natural Sciences, Chemical Engineering, Chemistry +13

Adsorption and Desorption of Bis-(3-sulfopropyl) Disulfide during Cu Electrodeposition and Stripping at Au Electrodes

Yong-Da Chiu, Wei-Ping Dow, Klaus Krug et al. · Langmuir · 2012 · 35 citations

Natural Sciences, Materials Engineering, Materials Science +17

Sensitivity Enhancement for Quantitative Electrochemical Determination of a Trace Amount of Accelerator in Copper Plating Solutions

Yong-Da Chiu, Wei-Ping Dow, Su-Mei Huang et al. · Journal of The Electrochemical Society · 2011 · 28 citations

Natural Sciences, Chemistry, Materials Science +17