Chang-Han Yun

AL to AL wafer bonding for MEMS encapsulation and 3-D interconnect

Chang-Han Yun, Jack Martin, Erik Tarvin et al. · Proceedings, IEEE micro electro mechanical systems · 2008 · 36 citations

Aluminium Nitride, Al Bonding, Engineering +18

Wafer-Level Packaging of MEMS Accelerometers with Through-Wafer Interconnects

Chang-Han Yun, Tim Brosnihan, William A. Webster et al. · 2005 · 21 citations

Engineering, Mechanical Engineering, Education +17

Cross-sectional dilation mode resonator with very high electromechanical coupling up to 10% using AlN

Chengjie Zuo, Chang-Han Yun, Philip J. Stephanou et al. · 2012 · 20 citations

Materials Science, Aluminium Nitride, Electrical Engineering +13

Clean and Conductive Wafer Bonding for MEMS

Chang-Han Yun, Jack Martin, Ling Chen et al. · ECS Transactions · 2008 · 20 citations

Materials Science, Materials Engineering, Wafer Scale Processing +15

Transfer of patterned ion-cut silicon layers

Chang-Han Yun, A. B. Wengrow, N.W. Cheung et al. · Applied Physics Letters · 1998 · 15 citations

Engineering, Pattern Transfer, Integrated Circuits +18