Ke Bai

Highly-integrated, miniaturized, stretchable electronic systems based on stacked multilayer network materials

Honglie Song, Guoquan Luo, Ziyao Ji et al. · Science Advances · 2022 · 203 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +16

A soft microrobot with highly deformable 3D actuators for climbing and transitioning complex surfaces

Wenbo Pang, Shiwei Xu, Jun Wu et al. · Proceedings of the National Academy of Sciences · 2022 · 141 citations · Full text

Engineering, Mechanical Engineering, Robotics Engineering +17

Assembly of complex 3D structures and electronics on curved surfaces

Zhaoguo Xue, Tianqi Jin, Shiwei Xu et al. · Science Advances · 2022 · 112 citations · Full text

Engineering, Biomedical Engineering, Materials Science +13

Geometrically reconfigurable 3D mesostructures and electromagnetic devices through a rational bottom-up design strategy

Ke Bai, Xu Cheng, Zhaoguo Xue et al. · Science Advances · 2020 · 71 citations · Full text

Engineering, Electrical Engineering, 3D Modeling +14

Rapidly deployable and morphable 3D mesostructures with applications in multimodal biomedical devices

Fan Zhang, Shupeng Li, Zhangming Shen et al. · Proceedings of the National Academy of Sciences · 2021 · 50 citations · Full text

Engineering, Bioengineering, Biomedical Engineering +17