Concepedia

Wenbo Pang

WP

17

Publications

1.4K

Citations

15

H-Index

2017

Active since

Affiliations

Tsinghua University(Current)

Beihang University

Xi'an Jiaotong University

University of Missouri

Northwestern University

Wenbo Pang is an author at Tsinghua University specializing in engineering, mechanical engineering, and flexible electronics.

Top concepts

EngineeringMaterial ScienceFlexible ElectronicsMechanical EngineeringSoft RoboticsMicrofabricationBiomedical Engineering3D PrintingSelf-assemblyBiofabrication

Publications per year

2017–2024

17

Publications

17

A three-dimensionally architected electronic skin mimicking human mechanosensation

Zhi Yong Liu, Xiaonan Hu, Renheng Bo et al. · Science · 2024 · 274 citations

Haptic Feedback, Engineering, Electronic Skin +20

Highly-integrated, miniaturized, stretchable electronic systems based on stacked multilayer network materials

Honglie Song, Guoquan Luo, Ziyao Ji et al. · Science Advances · 2022 · 196 citations · Full text

Engineering, Elastic Stretchability, Mechanical Engineering +17

Laser‐Induced Graphene for Electrothermally Controlled, Mechanically Guided, 3D Assembly and Human–Soft Actuators Interaction

Yun Ling, Wenbo Pang, Xiaopeng Li et al. · Advanced Materials · 2020 · 174 citations

A soft microrobot with highly deformable 3D actuators for climbing and transitioning complex surfaces

Wenbo Pang, Shiwei Xu, Jun Wu et al. · Proceedings of the National Academy of Sciences · 2022 · 131 citations · Full text

Assembly of complex 3D structures and electronics on curved surfaces

Zhaoguo Xue, Tianqi Jin, Shiwei Xu et al. · Science Advances · 2022 · 106 citations · Full text

Ordered Assembly, Engineering, Complex 3D +28

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