Concepedia

Lien Chin Wei

LC

Statistics

Publications

3

Citations

250

H-Index

3

Active since

2015

Affiliations

Carnegie Mellon University(Current)

Lien Chin Wei is an author at Carnegie Mellon University specializing in heat conduction, thermal properties of materials, and heat transfer.

Publications per year

2015–2018

3

Publications

3

Thermal conductivity of metal powders for powder bed additive manufacturing

Lien Chin Wei, Lili E. Ehrlich, Matthew J. Powell‐Palm et al. · Additive manufacturing · 2018 · 199 citations · Full text

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Interpretation of thermoreflectance measurements with a two-temperature model including non-surface heat deposition

Keith T. Regner, Lien Chin Wei, Jonathan A. Malen · Journal of Applied Physics · 2015 · 27 citations

, , +17

Amplified charge and discharge rates in phase change materials for energy storage using spatially-enhanced thermal conductivity

Lien Chin Wei, Jonathan A. Malen · Applied Energy · 2016 · 24 citations · Full text

, , +17

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