Concepedia

R.S. Bollampally

RB

2

Publications

755

Citations

2

H-Index

1999

Active since

Affiliations

Georgia Institute of Technology(Current)

R.S. Bollampally is an author at Georgia Institute of Technology specializing in engineering, electronic packaging, and heat transfer.

Top concepts

EngineeringHeat TransferPolymer ScienceMaterial ScienceThermal PropertiesThermal EngineeringElectronic PackagingPolymer ChemistryAdvanced PackagingCeramics Materials

Publications per year

1999–1999

2

Publications

2

Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging

C.P. Wong, R.S. Bollampally · Journal of Applied Polymer Science · 1999 · 667 citations · Full text

Engineering, Mechanical Engineering, Filled Composites +20

Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging

C.P. Wong, R.S. Bollampally · IEEE Transactions on Advanced Packaging · 1999 · 88 citations

Engineering, Conductive Fillers, Thermal Conductivity +21

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