Giorgio Allegato

Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies

Kai Zoschke, Charles-Alix Manier, Martin Wilke et al. · 2013 · 27 citations · Full text

Engineering, Mechanical Engineering, Resonator Components +19

A Versatile Timing Microsystem Based on Wafer-Level Packaged XTAL/BAW Resonators With Sub-$\mu$W RTC Mode and Programmable HF Clocks

David Ruffieux, Nicola Scolari, Frédéric Giroud et al. · IEEE Journal of Solid-State Circuits · 2013 · 19 citations

Engineering, Vlsi Design, Computer Architecture +18

Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices

Kai Zoschke, Charles-Alix Manier, Martin Wilke et al. · 2015 · 17 citations

Tsv Integration, Engineering, Oscillator Components +18

Investigation of key technologies for System-in-Package integration of inertial MEMS

Norman Marenco, Wolfgang Reinert, Stephan Warnat et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 2009 · 15 citations

Thelma-double: A New Technology Platform for Manufacturing of High-Performance Mems Inertial Sensors

Federico Vercesi, L. Corso, Giorgio Allegato et al. · 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS) · 2022 · 12 citations