Concepedia
Statistics
Publications
1
Citations
14
H-Index
Active since
1997
Andreas Ostmannm is an author specializing in engineering, electrical engineering, and flip-chip packaging.
Publications per year
1997–1997
A LOW COST BUMPING PROCESS FOR FLIP CHIP-TECHNOLOGY USING ELECTROLESS NICKEL BUMPING AND SOLDER BALL PLACEMENT
P. Kasulke, Andreas Ostmannm, E. Zakel et al. · 1997 · 14 citations
Engineering, Computer Engineering, Electrical Engineering +8
1–1 of 1