Concepedia

Jeffrey Demmin

JD

Statistics

Publications

5

Citations

120

H-Index

5

Active since

2002

Affiliations

Booz Allen Hamilton (United States)(Current)

Defense Advanced Research Projects Agency

Jeffrey Demmin is an author at Booz Allen Hamilton (United States) specializing in engineering, computer engineering, and microelectronics.

Top concepts

EngineeringMicroelectronicsComputer EngineeringNanoelectronicsIntegrated CircuitsElectronic PackagingElectrical EngineeringHeterogeneous IntegrationThree-dimensional Heterogeneous Integration3D Modeling

Publications per year

2002–2019

5

Publications

5

A Revolution on the Horizon from DARPA: Heterogeneous Integration for Revolutionary Microwave\/Millimeter-Wave Circuits at DARPA: Progress and Future Directions

Daniel S. Green, Carl L. Dohrman, Jeffrey Demmin et al. · IEEE Microwave Magazine · 2017 · 64 citations

Engineering, Radio Frequency, Device Integration +21

Heterogeneous and 3D Integration at DARPA

Timothy Hancock, Jeffrey Demmin · 2019 · 17 citations

Engineering, Device Integration, Chip Level +21

Path to 3D heterogeneous integration

Daniel S. Green, Carl L. Dohrman, Jeffrey Demmin et al. · 2015 · 15 citations

Engineering, Device Integration, Advanced Cs Devices +25

Laminated memory: a new 3-dimensional packaging technology for MCMs

David B. Tuckerman, Lara Bauer, N.E. Brathwaite et al. · 2002 · 14 citations

Engineering, Memory Chips, Emerging Memory Technology +17

Stacked chip scale packages: manufacturing issues, reliability results, and cost analysis

Jeffrey Demmin, Derek Baker, Wael Zohni · 2004 · 10 citations

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