Statistics
Publications
1
Citations
15
H-Index
1
Active since
2003
Affiliations
C.W. Lee is an author at Advanced Semiconductor Engineering (Taiwan) specializing in device reliability, package reliability, and package-level reliability.
Publications per year
2003–2003
1
1
A study in flip-chip UBM/bump reliability with effects of SnPb solder composition
J.D. Wu, P.J. Zheng, C.W. Lee et al. · 2003 · 15 citations
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