Statistics
Publications
2
Citations
43
H-Index
2
Active since
2003
Affiliations
Aptiv (United States)(Current)
D. Stepniak is an author at Aptiv (United States) specializing in alloys, electronic materials, and materials engineering.
Publications per year
2003–2003
2
2
Recent advances in flip chip wafer bumping using solder paste technology
P. Elenius, L. Leal, J. Ney et al. · 2003 · 28 citations
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