Statistics
Publications
1
Citations
28
H-Index
1
Active since
2003
Affiliations
Aptiv (United States)(Current)
J. Ney is an author at Aptiv (United States) specializing in electronic materials, direct wafer bonding, and shear strength analysis.
Publications per year
2003–2003
1
1
Recent advances in flip chip wafer bumping using solder paste technology
P. Elenius, L. Leal, J. Ney et al. · 2003 · 28 citations
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