Kjell Jeppson - Concepedia

Author

Kjell Jeppson

Also Known As

Jeppson, Kjell, K. Jeppson, K. O. Jeppson, K.O. Jeppson, Kjell Jeppson, Kjell O Jeppson, Kjell O. Jeppson, Kjell O. Jeppson Kjell O. Jeppson, Liu, Johan, Yan Zhang

137

Publications

2.7K

Citations

H-Index

Concepts

All Affiliations

Chalmers University of Technology Shanghai University Smart High Tech (Sweden)

About

Kjell Jeppson is an author at Chalmers University of Technology specializing in engineering, applied physics, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	20	37	2.3K
2	Applied Physics	18	26	1.5K
3	Education	2	2	34
4	Natural Sciences	1	1	11
5	Chemical Engineering	1	1	74

Kjell Jeppson

Publications

2.4K

Citations

H-Index

Page 1

	Year	Citations
Negative bias stress of MOS devices at high electric fields and degradation of MNOS devices Kjell Jeppson, Christer Svensson Journal of Applied Physics EngineeringEmerging Memory TechnologyIntegrated CircuitsNegative ShiftSemiconductor Device	1977	672
CMOS Circuit Speed and Buffer Optimization N. Hedenstierna, Kjell Jeppson IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems Timing ModelElectrical EngineeringEngineeringVlsi DesignCircuit Design	1987	457
Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application Yong Zhang, Haoxue Han, Nan Wang, Advanced Functional Materials EngineeringChemistryIn‐plane Heat ConductionThermal ConductivityGraphene Nanomeshes	2015	142
Modeling the influence of the transistor gain ratio and the input-to-output coupling capacitance on the CMOS inverter delay Kjell Jeppson IEEE Journal of Solid-State Circuits Device ModelingElectrical EngineeringTransistor Gain RatioEngineeringCmos Inverter Delay	1994	116
Synthesis and applications of two-dimensional hexagonal boron nitride in electronics manufacturing Jie Bao, Kjell Jeppson, Michael Edwards, Electronic Materials Letters Materials ScienceBoron NitrideEngineeringElectronic MaterialsHexagonal Boron Nitride	2016	82
Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests Teng Wang, Si Chen, Di Jiang, IEEE Electron Device Letters EngineeringNanoporous MaterialCmos CompatibilityInterconnect (Integrated Circuits)Chemical Engineering	2012	74
Applications of Aluminium Nitride Films Deposited by Reactive Sputtering to Silicon-On-Insulator Materials Stefan Bengtsson, Mats Bergh, M. Choumas, Japanese Journal of Applied Physics Aluminium NitrideEngineeringChemical DepositionSilicon On InsulatorNanoelectronics	1996	66
Through silicon vias filled with planarized carbon nanotube bundles Teng Wang, Kjell Jeppson, Niklas Olofsson, Nanotechnology	2009	64
Vertically Stacked Carbon Nanotube-Based Interconnects for Through Silicon Via Application Di Jiang, Wei Mu, Si Chen, IEEE Electron Device Letters Cnt Vias3D Ic ArchitectureElectrical EngineeringWafer Scale ProcessingEngineering	2015	52
Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects Shuangxi Sun, Wei Mu, Michael Edwards, Nanotechnology	2016	50

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