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Wen-Kai Le

WL

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Publications

2

Citations

32

H-Index

2

Active since

2019

Affiliations

South China University of Technology(Current)

Wen-Kai Le is an author at South China University of Technology specializing in mechanical engineering, materials science, and mechanics of materials.

Top concepts

Publications per year

2019–2022

2

Publications

2

Current density dependent shear performance and fracture behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads

Wen-Kai Le, Xiang Liang Ning, Chang-Bo Ke et al. · Journal of Materials Science Materials in Electronics · 2019 · 20 citations

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The effects of the decreasing joint size on interfacial microstructure and shear behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads

Wen-Kai Le, M. B. Zhou, Xin‐Ping Zhang · Journal of Materials Science Materials in Electronics · 2022 · 12 citations

, , +9

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