Concepedia

Wangkun Jia

WJ

Statistics

Publications

4

Citations

91

H-Index

4

Active since

2014

Affiliations

Clarkson University(Current)

Wangkun Jia is an author at Clarkson University specializing in thermal engineering, microelectronics, and heat transfer.

Top concepts

EngineeringHeat TransferDevice ModelingMicroelectronicsThermal ModelingThermal EngineeringElectrical EngineeringThermodynamicsNanoelectronicsComputer Engineering

Publications per year

2014–2022

4

Publications

4

Thermal Modeling of Multi-Fin Field Effect Transistor Structure Using Proper Orthogonal Decomposition

Wangkun Jia, Brian T. Helenbrook, Ming-Cheng Cheng · IEEE Transactions on Electron Devices · 2014 · 32 citations

Engineering, Proper Orthogonal Decomposition, Physical Design (Electronics) +17

Fast Thermal Simulation of FinFET Circuits Based on a Multiblock Reduced-Order Model

Wangkun Jia, Brian T. Helenbrook, Ming‐C. Cheng · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2015 · 29 citations

Fast Thermal Simulation, Engineering, Vlsi Design +18

An Effective Thermal Model for FinFET Structure

Ming-Cheng Cheng, J. A. Smith, Wangkun Jia et al. · IEEE Transactions on Electron Devices · 2014 · 20 citations

Engineering, Mechanical Engineering, Physics-based Thermal Model +17

A methodology for thermal simulation of interconnects enabled by model reduction with material property variation

Wangkun Jia, Ming‐C. Cheng · Journal of Computational Science · 2022 · 10 citations · Full text

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