Concepedia

Tzu‐Heng Hung

TH

6

Publications

122

Citations

6

H-Index

2016

Active since

Affiliations

National Yang Ming Chiao Tung University(Current)

Nanya Technology (Taiwan)

Tzu‐Heng Hung is an author at National Yang Ming Chiao Tung University specializing in surface science, applied physics, and engineering.

Top concepts

EngineeringApplied PhysicsSurface ScienceMaterial ScienceChemistryElectronic PackagingMaterials EngineeringCorrosionThin FilmsNanomaterials

Publications per year

2016–2024

6

Publications

6

Direct metal bonding using nanotwinned Ag films with (1 1 1) surface orientation under air atmosphere for heterogeneous integration

Leh-Ping Chang, Jianjie Wang, Tzu‐Heng Hung et al. · Applied Surface Science · 2021 · 31 citations

Materials Science, Engineering, Nanomaterials +11

Investigation of Wet Pretreatment to Improve Cu-Cu Bonding for Hybrid Bonding Applications

Tzu‐Heng Hung, Ting-Cih Kang, Shan-Yu Mao et al. · 2021 · 26 citations

Materials Science, Materials Engineering, Chemical Engineering +15

Chemical Constituents of Phaius mishmensis

Chen-Wei Jao, Tzu‐Heng Hung, Chi‐Fen Chang et al. · Molecules · 2016 · 25 citations · Full text

TSV Integration With Chip Level TSV-to-Pad Cu/SiO₂ Hybrid Bonding for DRAM Multiple Layer Stacking

Tzu‐Heng Hung, James Yi-Jen Lo, Tzu-Ying Kuo et al. · IEEE Electron Device Letters · 2023 · 17 citations

Tsv Integration, Engineering, Room Temperature Bonding +17

A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications

Yuan-Chiu Huang, Yu-Xian Lin, Chien-Kang Hsiung et al. · IEEE Electron Device Letters · 2024 · 13 citations

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