F.N. Masana

A closed form solution of junction to substrate thermal resistance in semiconductor chips

F.N. Masana · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1996 · 94 citations

Numerical Analysis, Engineering, Computer-aided Design +28

A new approach to the dynamic thermal modelling of semiconductor packages

F.N. Masana · Microelectronics Reliability · 2001 · 81 citations

Engineering, Dynamic Thermal Modelling, Refrigeration +16

A simple method for evaluating the transient thermal response of semiconductor devices

N.Y.A. Shammas, M.P. Rodriguez, F.N. Masana · Microelectronics Reliability · 2002 · 45 citations

Semiconductor Devices, Electrical Engineering, Engineering +13

Synthesis and characterisation of metal suboxides for gas sensors

J. Calderer, P. Molinàs, J.E. Sueiras et al. · Microelectronics Reliability · 2000 · 39 citations

Inorganic Chemistry, Metal Suboxides, Engineering +7

A straightforward analytical method for extraction of semiconductor device transient thermal parameters

F.N. Masana · Microelectronics Reliability · 2006 · 38 citations

Device Modeling, Electrical Engineering, Engineering +11