Concepedia
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Publications
1
Citations
10
H-Index
Active since
2019
Affiliations
Fraunhofer Institute for Reliability and Microintegration(Current)
Jordan Kossev is an author at Fraunhofer Institute for Reliability and Microintegration.
Publications per year
2019–2019
Process Modules for High-Density Interconnects in Panel-Level Packaging
Friedrich‐Leonhard Schein, R. Kahle, Marc Kunz et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 10 citations · Full text
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