Concepedia

I.G. Shih

IS

2

Publications

45

Citations

2

H-Index

2003

Active since

Affiliations

Macronix International (Taiwan)(Current)

National Taiwan University

I.G. Shih is an author at Macronix International (Taiwan) specializing in electronic packaging, engineering, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMechanics Of MaterialsTechnologyMicrostructureApplied PhysicsSolid MechanicsMaterial ScienceMicrofabrication

Publications per year

2003–2006

2

Publications

2

Study on the Effects of Wafer Thinning and Dicing on Chip Strength

Sih‐Huan Chen, C.Z. Tsai, E. Wu et al. · IEEE Transactions on Advanced Packaging · 2006 · 33 citations

Engineering, Mechanical Engineering, Wafer Scale Processing +19

Influence of grinding process on semiconductor chip strength

Enboa Wu, I.G. Shih, Y.N. Chen et al. · 2003 · 12 citations

Engineering, Backside Grinding, Strength Distribution +11

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