Concepedia

HanMin Lee

HL

1

Publications

11

Citations

1

H-Index

2020

Active since

Affiliations

Doosan (South Korea)(Current)

HanMin Lee is an author at Doosan (South Korea) specializing in electronic packaging, applied physics, and microelectronics.

Top concepts

EngineeringMicrostructureApplied PhysicsSolid MechanicsMaterial ScienceMicroelectronicsThermal EngineeringElectronic PackagingMaterials EngineeringMechanical Engineering

Publications per year

2020–2020

1

Publications

1

Effect of the Curing Properties and Viscosities of Nonconductive Films on the Solder Joint Morphology and Reliability of Chip-On-Board Packages Using Cu-Pillar/Sn–Ag Bumps

HanMin Lee, Seyong Lee, Taejin Choi et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 11 citations

Engineering, Mechanical Engineering, Curing Properties +18

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