J.-S. Lee

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Active since

2004

Affiliations

Electronics and Telecommunications Research Institute(Current)

Korea Advanced Institute of Science and Technology

J.-S. Lee is an author at Electronics and Telecommunications Research Institute specializing in device fabrication, vertical-cavity surface-emitting lasers, and flip-chip bonding.

Publications per year

2004–2006

Publications

A Fluxless Flip-Chip Bonding for VCSEL Arrays Using Silver-Coated Indium Solder Bumps

Kunmo Chu, J.-S. Lee, H.S. Cho et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2004 · 15 citations

Engineering, Materials Engineering, Materials Science +16

Optoelectronic and Microwave Transmission Characteristics of Indium Solder Bumps for Low-Temperature Flip-Chip Applications

Kunmo Chu, Jaehoon Choi, J.-S. Lee et al. · IEEE Transactions on Advanced Packaging · 2006 · 13 citations

Engineering, Electrical Engineering, Materials Science +17

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