B.S. Lall

Methodology for thermal evaluation of multichip modules

B.S. Lall, B.M. Guenin, R. J. Molnar · 2002 · 48 citations

Engineering, Computer Engineering, Heat Transfer +16

Thermal design rules for electronic components on conducting boards in passively cooled enclosures

B.S. Lall, Alfonso Ortega · 2002 · 31 citations

Engineering, Mechanical Engineering, Finite Element Analysis +12

Methodology for thermal evaluation of multichip modules

B.S. Lall, B.N. Guenin, R.J. Molnar · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1995 · 23 citations

Engineering, Computer Engineering, Heat Transfer +16

Natural convection air cooling of a discrete source on a conducting board in a shallow horizontal enclosure

Alfonso Ortega, B.S. Lall · 2002 · 16 citations

Engineering, Mechanical Engineering, Heat Transfer +16

Heat transfer in a low aspect ratio horizontal enclosure for laptop computer application

Alfonso Ortega, B.S. Lall, J.D. Chicci et al. · 2002 · 12 citations

Engineering, Computer Engineering, Mechanical Engineering +17