Concepedia

Sharan Kallolimath

SK

3

Publications

60

Citations

3

H-Index

2005

Active since

Affiliations

Lamar University(Current)

Sharan Kallolimath is an author at Lamar University specializing in mechanics of materials, engineering, and heat transfer.

Top concepts

EngineeringHeat TransferElectronic PackagingMechanical EngineeringMechanics Of MaterialsRheology3D PrintingHydromechanicsThermodynamicsSolid Mechanics

Publications per year

2005–2006

3

Publications

3

Investigation of non-uniform moisture distribution on determination of hygroscopic swelling coefficient and finite element modeling for a flip chip package

Jiang Zhou, S.P. Lahoti, Muskan Sitlani et al. · 2005 · 36 citations

Engineering, Flip Chip Package, Mechanical Engineering +17

Finite element analysis of thermo-hygro-mechanical failure of a flip chip package

S.P. Lahoti, Sharan Kallolimath, Jiang Zhou · 2006 · 14 citations

Engineering, Flip Chip Package, Mechanical Engineering +20

Investigation of Inter-Layer Dielectric (ILD) Failure by Hygroscopic Swelling

Jiang Zhou, S.P. Lahoti, Muskan Sitlani et al. · 2005 · 10 citations

Rows per page

1–3 of 3