Mohammad Hossein Mahdavifard

The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn–1Ag–0.5Cu solder alloy

Mohammad Hossein Mahdavifard, Mohd Faizul Mohd Sabri, Dhafer Abdul Ameer Shnawah et al. · Microelectronics Reliability · 2015 · 67 citations

Natural Sciences, Materials Engineering, Materials Science +17

High stability and aging resistance Sn-1Ag-0.5Cu solder alloy by Fe and Bi minor alloying

Mohammad Hossein Mahdavifard, Mohd Faizul Mohd Sabri, Suhana Mohd Said et al. · Microelectronic Engineering · 2019 · 34 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +16

Effect of temperature and alloying elements (Fe and Bi) on the electrical resistivity of Sn–0.7Cu solder alloy

Mohd Faizul Mohd Sabri, Shaifulazuar Rozali, Mohammad Hossein Mahdavifard et al. · RSC Advances · 2016 · 28 citations

Natural Sciences, Materials Engineering, Materials Science +17

Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment

Bakhtiar Ali, Mohd Faizul Mohd Sabri, Suhana Mohd Said et al. · Microelectronics Reliability · 2018 · 24 citations

Natural Sciences, Materials Engineering, Materials Science +15

Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi

Syed Hassan Abbas Jaffery, Mohd Faizul Mohd Sabri, Shaifulazuar Rozali et al. · Microelectronics Reliability · 2022 · 24 citations

Engineering, Materials Engineering, Materials Science +10