Statistics
Publications
2
Citations
39
H-Index
2
Active since
2012
Affiliations
Dow Chemical (China)(Current)
Min-Feng Ku is an author at Dow Chemical (China) specializing in engineering, electronic packaging, and materials science.
Publications per year
2012–2013
2
2
The evolution of organic solderability preservative (OSP) process in PCB application
K. H. Tong, Min-Feng Ku, K. L. Hsu et al. · 2013 · 12 citations
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