Sanghuck Jeon

Development of a novel wet cleaning solution for Post-CMP SiO2 and Si3N4 films

Jung-Hwan Song, Ki‐Hong Park, Sanghuck Jeon et al. · Materials Science in Semiconductor Processing · 2021 · 25 citations

Materials Science, Materials Engineering, Chemical Engineering +13

Investigation of abrasive behavior between pad asperity and oxide thin film in chemical mechanical planarization

Sanghuck Jeon, Jungryul Lee, Seok‐Jun Hong et al. · Materials Science in Semiconductor Processing · 2021 · 19 citations

Materials Engineering, Materials Science, Chemical Engineering +10

Simulation and Experimental Investigation of the Radial Groove Effect on Slurry Flow in Oxide Chemical Mechanical Polishing

Yeongkwang Cho, Pengzhan Liu, Sanghuck Jeon et al. · Applied Sciences · 2022 · 19 citations · Full text

Engineering, Mechanical Engineering, Radial Groove Effect +20

Investigation of abrasive-free slurry for polysilicon buffing chemical mechanical planarization

Sanghuck Jeon, Jiah Hong, Seok‐Jun Hong et al. · Materials Science in Semiconductor Processing · 2021 · 17 citations

Materials Science, Engineering, Material Processing +6

The mechanical effect of soft pad on copper chemical mechanical polishing

Pengzhan Liu, Yuna Nam, Seunghwan Lee et al. · Materials Science in Semiconductor Processing · 2022 · 15 citations