Armen Kteyan

Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks

Xin Huang, Armen Kteyan, Sheldon X.-D. Tan et al. · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2016 · 87 citations

Engineering, Power Engineering, Power Grid Operation +19

Postvoiding Stress Evolution in Confined Metal Lines

Valeriy Sukharev, Armen Kteyan, Xin Huang · IEEE Transactions on Device and Materials Reliability · 2015 · 61 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +23

Microstructure Effect on EM-Induced Degradations in Dual Inlaid Copper Interconnects

Valeriy Sukharev, Armen Kteyan, Ehrenfried Zschech et al. · IEEE Transactions on Device and Materials Reliability · 2009 · 51 citations

Engineering, Stress Evolution, Novel Physical Model +19

Physics-based simulation of stress-induced and electromigration-induced voiding and their interactions in on-chip interconnects

Armen Kteyan, Valeriy Sukharev · Microelectronic Engineering · 2021 · 24 citations

3D Ic Architecture, Electrical Engineering, Electromigration-induced Voiding +12

Physics-Based Models for EM and SM Simulation in Three-Dimensional IC Structures

Valeriy Sukharev, Armen Kteyan, Ehrenfried Zschech · IEEE Transactions on Device and Materials Reliability · 2012 · 20 citations

Engineering, Nearby Tsvs, Computational Mechanics +24