Chia-Lung Lee

Pore formation in silicon by wet etching using micrometre-sized metal particles as catalysts

Chia-Lung Lee, Kazuya Tsujino, Yuji Kanda et al. · Journal of Materials Chemistry · 2008 · 177 citations

Engineering, Nanoporous Material, Micrometre-sized Metal Particles +20

Electrochemical Grooving of Si Wafers Using Catalytic Wire Electrodes in HF Solution

Chia-Lung Lee, Yuji Kanda, Takeshi Hirai et al. · Journal of The Electrochemical Society · 2008 · 18 citations

Engineering, Catalytic Wire Electrodes, Au Wire Electrodes +17

Formation of Through-Holes in Si Wafers by Using Anodically Polarized Needle Electrodes in HF Solution

Tomohiko Sugita, Chia-Lung Lee, Shigeru Ikeda et al. · ACS Applied Materials & Interfaces · 2011 · 18 citations

Engineering, Nanoporous Material, Silicon On Insulator +21

Formation of 100 μm Deep Vertical Pores in Si Wafers by Wet Etching and Cu Electrodeposition

Chia-Lung Lee, Shinsuke Tsuru, Yuji Kanda et al. · Journal of The Electrochemical Society · 2009 · 17 citations

Cu Electrodeposition, Engineering, Nanoporous Material +25

Electrochemical method for slicing Si blocks into wafers using platinum wire electrodes

Chia-Lung Lee, Yuji Kanda, Shigeru Ikeda et al. · Solar Energy Materials and Solar Cells · 2010 · 16 citations

Materials Engineering, Materials Science, Electrical Engineering +12