Concepedia

Toshiki Kurosu

TK

3

Publications

65

Citations

3

H-Index

1992

Active since

Affiliations

Hitachi (Japan)(Current)

Toshiki Kurosu is an author at Hitachi (Japan) specializing in mechanical engineering, electronic packaging, and engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMaterial ScienceThermal EngineeringElectrical EngineeringHigh Temperature MaterialsHeat TransferRefrigerationMicrostructure

Publications per year

1992–2010

3

Publications

3

Thermal and Structural Simulation Techniques for Estimating Fatigue Life of an IGBT Module

Koji Sasaki, Naoko Iwasa, Toshiki Kurosu et al. · 2008 · 39 citations

Engineering, Mechanical Engineering, Structural Simulation Techniques +21

Packaging technologies of direct-cooled power module

Toshiki Kurosu, Koji Sasaki, Atsuo Nishihara et al. · 2010 · 14 citations

Engineering, Energy Efficiency, Mechanical Engineering +17

Bonding mechanism between aluminum nitride substrate and Ag-Cu-Ti solder

Y. Kurihara, S. Takahashi, Satoru OGIHARA et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1992 · 12 citations

Materials Science, Materials Engineering, Aluminium Nitride +13

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