Kailin Pan - Concepedia

Author

Kailin Pan

Guilin University of Electronic Technology ORCID

Also Known As

K. L. Pan, K. Pan, K.L. Pan, Kai-Lin Pan, Kai-lin Pan, Kailin Pan, Klinsmann Pan, Kunyang Pan, Pan Kai-lin, Pan Kailin

107

Publications

334

Citations

H-Index

Concepts

All Affiliations

Guilin University of Electronic Technology Guilin University

About

Kailin Pan is an author at Guilin University of Electronic Technology specializing in engineering, electrical engineering, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	7	7	120
2	Electrical Engineering	4	4	64
3	Applied Physics	1	1	12
4	Computer Engineering	1	1	18
5	Computer Science	1	1	18

Kailin Pan

Publications

140

Citations

H-Index

Page 1

	Year	Citations
Numerical simulation on heat pipe for high power LED multi-chip module packaging Dongmei Li, G. Q Zhang, Kailin Pan, EngineeringLiquid Metal CoolingEnergy EfficiencyHeat PipeAdvanced Packaging (Semiconductors)	2009	26
The effect of solder paste volume on surface mount assembly self-alignment Kailin Pan, Jong Hwan Ha, H.Y. Wang, Procedia Manufacturing EngineeringMechanical EngineeringAdvanced ManufacturingMolten SolderAdvanced Packaging (Semiconductors)	2019	21
Image defect classification of surface mount technology welding based on the improved ResNet model Qiang Zhang, Kaiyun Zhang, Kailin Pan, Journal of Engineering Research Data Amplification MethodsEngineeringFeature DetectionMechanical EngineeringImage Defect Classification	2024	18
Effect of In-Doping on Mechanical Properties of Cu6Sn5-Based Intermetallic Compounds: A First-Principles Study Wei Huang, Kailin Pan, Jian Zhang, Journal of Electronic Materials Materials EngineeringMaterials ScienceCu6sn5-based Intermetallic CompoundsEngineeringMechanical Properties	2021	17
Thermal analysis of multi-chip module high power LED packaging Kailin Pan, Ren Guotao, Peng Li, Advanced PackagingElectrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)	2011	16
Abnormal Shear Performance of Microscale Ball Grid Array Structure Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints with Increasing Current Density Bo Wang, Wangyun Li, Kailin Pan Crystals Materials ScienceElectrical EngineeringEngineeringMechanical PropertiesMechanical Behavior	2022	12
Research on LED temperature characteristic and thermal analysis at low temperatures Yu Guo, Kailin Pan, Ren Guotao, Electrical EngineeringSolid-state LightingLow TemperaturesEngineeringTemperature Measurement	2012	10
Research on solder joint intelligent optical inspection analysis Li Ni, Kailin Pan, Peng Li	2008	10
Shear performance of microscale ball grid array structure Sn–3.0Ag–0.5Cu solder joints with different surface finish combinations under electro-thermo-mechanical coupled loads Bo Wang, Wangyun Li, Kailin Pan Journal of Materials Science Materials in Electronics	2022	10

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