Concepedia

Kailin Pan

KP

9

Publications

140

Citations

9

H-Index

2008

Active since

Affiliations

Guilin University of Electronic Technology(Current)

Guilin University

Kailin Pan is an author at Guilin University of Electronic Technology specializing in engineering, electrical engineering, and electronic packaging.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringMechanical EngineeringHeat TransferMicrostructureMaterial ScienceThermal ModelingThermal EngineeringMicroelectronics

Publications per year

2008–2024

9

Publications

9

Numerical simulation on heat pipe for high power LED multi-chip module packaging

Dongmei Li, G. Q Zhang, Kailin Pan et al. · 2009 · 26 citations

Engineering, Liquid Metal Cooling, Energy Efficiency +18

The effect of solder paste volume on surface mount assembly self-alignment

Kailin Pan, Jong Hwan Ha, H.Y. Wang et al. · Procedia Manufacturing · 2019 · 21 citations · Full text

Engineering, Mechanical Engineering, Advanced Manufacturing +16

Image defect classification of surface mount technology welding based on the improved ResNet model

Qiang Zhang, Kaiyun Zhang, Kailin Pan et al. · Journal of Engineering Research · 2024 · 18 citations · Full text

Data Amplification Methods, Engineering, Feature Detection +18

Effect of In-Doping on Mechanical Properties of Cu6Sn5-Based Intermetallic Compounds: A First-Principles Study

Wei Huang, Kailin Pan, Jian Zhang et al. · Journal of Electronic Materials · 2021 · 17 citations

Materials Engineering, Materials Science, Cu6sn5-based Intermetallic Compounds +8

Thermal analysis of multi-chip module high power LED packaging

Kailin Pan, Ren Guotao, Peng Li et al. · 2011 · 16 citations

Advanced Packaging, Electrical Engineering, Chip-scale Package +13

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