Jing Wan - Concepedia

Author

Jing Wan

Also Known As

Goh Foong Jing, Wan Nurâ€™ Aqilah binti Wan AB Razak, Zuraida Ab Rahman1 and Sreeramanan Subramaniam, J. B. Wan, J.B. Wan, Jing Bo Wan, Jing WAN, Jing Wan

Publications

468

Citations

H-Index

Concepts

All Affiliations

Murdoch University Tianjin University Institute of Plant Protection Chinese Academy of Agricultural Sciences Guangdong Academy of Agricultural Sciences

About

Jing Wan is an author at Murdoch University specializing in engineering, materials science, and materials engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	4	4	101
2	Materials Engineering	4	4	101
3	Materials Science	4	4	101
4	Applied Physics	3	3	85
5	Chemistry	1	1	16

Jing Wan

Publications

420

Citations

H-Index

Page 1

	Year	Citations
Biology, invasion and management of the agricultural invader: Fall armyworm, Spodoptera frugiperda (Lepidoptera: Noctuidae) Jing Wan, Cong Huang, Changyou Li, Journal of Integrative Agriculture	2021	199
Microstructures of eutectic Sn–Ag–Zn solder solidified with different cooling rates Y.C. Liu, Yaqiong Han, Jing Wan, Journal of Alloys and Compounds Materials ScienceMaterials EngineeringEngineeringApplied PhysicsSolidification	2007	46
Predicting the potential geographic distribution of Bactrocera bryoniae and Bactrocera neohumeralis (Diptera: Tephritidae) in China using MaxEnt ecological niche modeling Jing Wan, Guojun Qi, Jun Ma, Journal of Integrative Agriculture	2020	46
Source Regions of the First Immigration of Fall Armyworm, Spodoptera frugiperda (Lepidoptera: Noctuidae) Invading Australia Guojun Qi, Jian Ma, Jing Wan, Insects	2021	44
Potential Distribution and the Risks of Bactericera cockerelli and Its Associated Plant Pathogen Candidatus Liberibacter Solanacearum for Global Potato Production Jing Wan, Rui Wang, Yonglin Ren, Insects	2020	30
Intermediate decomposition of metastable Cu5Zn8 phase in the soldered Sn–Ag–Zn/Cu interface Y.C. Liu, Jing Wan, Zhiming Gao Journal of Alloys and Compounds Materials ScienceMaterials EngineeringEngineeringSurface ScienceApplied Physics	2007	24
Effect of Al content on the formation of intermetallic compounds in Sn–Ag–Zn lead-free solder Jing Wan, Yi Liu, Z. M. Gao, Journal of Materials Science Materials in Electronics Materials EngineeringMaterials ScienceIntermetallic CompoundsAl ContentEngineering	2007	16
Effect of the soldering time on the formation of interfacial structure between Sn–Ag–Zn lead-free solder and Cu substrate Jing Wan, Yong Chang Liu, Wei Chen, Journal of Materials Science Materials in Electronics Materials EngineeringMaterials ScienceEngineeringInterfacial StructureApplied Physics	2007	15

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