Y.C. Liu

Strengthening mechanism of SiC-particulate reinforced Sn–3.7Ag–0.9Zn lead-free solder

Xiaofei Wang, Y.C. Liu, Hong Gao et al. · Journal of Alloys and Compounds · 2009 · 77 citations

Materials Science, Materials Engineering, Engineering +2

Transient liquid phase (TLP) bonding of Ti2AlNb alloy using Ti/Ni interlayer: Microstructure characterization and mechanical properties

Xiaoqiang Cai, Ying Wang, Zhenwen Yang et al. · Journal of Alloys and Compounds · 2016 · 72 citations

Materials Engineering, Materials Science, Ti/ni Interlayer +8

Formation mechanism of granular bainite in a 30CrNi3MoV steel

Zhen Qiao, Y.C. Liu, Liming Yu et al. · Journal of Alloys and Compounds · 2008 · 65 citations

Materials Science, Engineering, Formation Mechanism +3

Diffusion bonding of Ti2AlNb alloy using pure Ti foil as an interlayer

Ying Wang, Xiaoqiang Cai, Zhenwen Yang et al. · Journal of Alloys and Compounds · 2018 · 51 citations

Materials Science, Materials Engineering, Engineering +9

Microstructures of eutectic Sn–Ag–Zn solder solidified with different cooling rates

Y.C. Liu, Yaqiong Han, Jing Wan et al. · Journal of Alloys and Compounds · 2007 · 46 citations

Materials Science, Materials Engineering, Engineering +6