Stephen H. Pan - Concepedia

Author

Stephen H. Pan

Agilent Technologies (United States)

Also Known As

Jimin Wen, S. Pan, S.H. Pan, Stephen H. Pan, Stephen Pan

Publications

367

Citations

H-Index

Concepts

All Affiliations

Agilent Technologies (United States)Ansys (United States)Optimal Solutions (United States)Agilent Technologies (Germany)

About

Stephen H. Pan is an author at Agilent Technologies (United States) specializing in engineering, electronic packaging, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	12	13	314
2	Electrical Engineering	9	9	234
3	Computer Engineering	6	6	160
4	Applied Physics	5	5	119
5	Computer Science	2	2	46

Stephen H. Pan

Publications

314

Citations

H-Index

Page 1

	Year	Citations
A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints John H. Lau, Stephen H. Pan, Chris Chang Journal of Electronic Packaging EngineeringMechanical EngineeringCorner Solder JointReliability EngineeringAdvanced Packaging (Semiconductors)	2002	55
DNN-based Fast Static On-chip Thermal Solver Jimin Wen, Stephen H. Pan, Norman Chang, EngineeringComputational MechanicsThermal Gradient On-chipThermal AnalysisThermodynamics	2020	35
Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch John H. Lau, Z. Mei, Sen Pang, Journal of Electronic Packaging Advanced PackagingIsothermal Fatigue TestsElectrical EngineeringCreep AnalysisThermal-fatigue Life Prediction	2002	31
Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board John H. Lau, Stephen H. Pan, Chris Chang Journal of Electronic Packaging Creep AnalysisEngineeringMechanical EngineeringLead-free SolderMicrovia Build-up Pcb	2002	28
ML-based Fast On-Chip Transient Thermal Simulation for Heterogeneous 2.5D/3D IC Designs Akhilesh Kumar, Norman Chang, David Geb, EngineeringVlsi DesignComputer ArchitectureIc DesignsPhysical Design (Electronics)	2022	28
Effects of voids on bump chip carrier (BCC++) solder joint reliability John H. Lau, S. Erasmus, Stephen H. Pan Electrical EngineeringReliability EngineeringEngineeringBump Chip CarrierSolder Joint Reliability	2003	23
Creep behaviors of flip chip on board with 96.5Sn-3.5Ag and 100In lead-free solder joints John H. Lau, Stephen H. Pan The International journal of microcircuits and electronic packaging Materials ScienceFlip ChipPcb AssembliesChip-scale PackageEngineering	2000	22
3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components John H. Lau, Stephen H. Pan Journal of Electronic Packaging EngineeringSpontaneous Chemical ReactionSevere Plastic DeformationMechanical EngineeringResidual Stress	2003	19
Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications John H. Lau, S. W. Ricky Lee, Stephen H. Pan, Journal of Electronic Packaging EngineeringMechanical EngineeringIntegrated CircuitsSolder BumpFlip Chip	2002	19
3D-IC dynamic thermal analysis with hierarchical and configurable chip thermal model Stephen H. Pan, Norman Chang, Tadaaki Hitomi EngineeringEnergy EfficiencyComputer ArchitectureChip Thermal ModelAdvanced Packaging (Semiconductors)	2013	16

Page 1