Stephen H. Pan

A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints

John H. Lau, Stephen H. Pan, Chris Chang · Journal of Electronic Packaging · 2002 · 55 citations

Engineering, Mechanical Engineering, Corner Solder Joint +21

DNN-based Fast Static On-chip Thermal Solver

Jimin Wen, Stephen H. Pan, Norman Chang et al. · 2020 · 35 citations

Engineering, Computational Mechanics, Thermal Gradient On-chip +19

Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch

John H. Lau, Z. Mei, Sen Pang et al. · Journal of Electronic Packaging · 2002 · 31 citations

Advanced Packaging, Isothermal Fatigue Tests, Electrical Engineering +13

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

John H. Lau, Stephen H. Pan, Chris Chang · Journal of Electronic Packaging · 2002 · 28 citations

Creep Analysis, Engineering, Mechanical Engineering +18

ML-based Fast On-Chip Transient Thermal Simulation for Heterogeneous 2.5D/3D IC Designs

Akhilesh Kumar, Norman Chang, David Geb et al. · 2022 · 28 citations

Engineering, Vlsi Design, Computer Architecture +19