Concepedia

Chingfu Tsou

CT

20

Publications

442

Citations

13

H-Index

2005

Active since

Affiliations

Feng Chia University(Current)

Central Taiwan University of Science and Technology

National Tsing Hua University

Laboratoire Interdisciplinaire de Physique

Centre National de la Recherche Scientifique

Chingfu Tsou is an author at Feng Chia University specializing in engineering, microfabrication, and electronic packaging.

Top concepts

EngineeringMicrofabricationElectronic PackagingMicroelectronicsMechanical EngineeringApplied PhysicsElectrical EngineeringMaterial ScienceOptoelectronicsMicrofluidics

Publications per year

2005–2019

20

Publications

20

Silicon-Based Packaging Platform for Light-Emitting Diode

Chingfu Tsou, Yi-Wen Huang · IEEE Transactions on Advanced Packaging · 2006 · 80 citations

Engineering, Device Integration, Silicon-based Packaging Platform +16

The implementation of a thermal bubble actuated microfluidic chip with microvalve, micropump and micromixer

Cheng‐Han Huang, Chingfu Tsou · Sensors and Actuators A Physical · 2014 · 65 citations

Microfluidic Chip, Engineering, Microfabrication +9

A novel self-aligned vertical electrostatic combdrives actuator for scanning micromirrors

Chingfu Tsou, Wei-Jhih Lin, Chun‐Yu Fan et al. · Journal of Micromechanics and Microengineering · 2005 · 33 citations

Novel Vertical Combdrives, Engineering, Micromachines +14

Reliability assessment using modified energy based model for WLCSP solder joints

Chingfu Tsou, Ting-Fu Chang, Kuo‐Wei Wu et al. · 2017 · 32 citations

Engineering, Reliability Assessment, Mechanical Engineering +17

On the Determination of Thermal Expansion Coefficient of Thermal Oxide

Chingfu Tsou, Yongyi HUANG, H. C. Chang · TechConnect Briefs · 2005 · 23 citations

Engineering, Mechanical Engineering, Buckling Profiles +20

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