J. Y. Chen

EMI Shielding Technology in 5G RF System in Package Module

Jay Li, Mike Tsai, Ryan Chiu et al. · 2020 · 34 citations

Electrical Engineering, Millimeter Wave Technology, Engineering +15

Innovative Packaging Solutions of 3D Double Side Molding with System in Package for IoT and 5G Application

Mike Tsai, Ryan Chiu, Dick Huang et al. · 2019 · 22 citations

Advanced Packaging, Materials Science, 3D Ic Architecture +13

Alternative 3D Small form Factor Methodology of System in Package for IoT and Wearable Devices Application

Mike Tsai, Albert Lan, Chi Liang Shih et al. · 2017 · 16 citations

Engineering, Wearable Technology, Integrated Circuits +23

Innovative Packaging Solutions of 3D System in Package with Antenna Integration for IoT and 5G Application

Mike Tsai, Ryan Chiu, Eric He et al. · 2018 · 11 citations

Wireless Communications, Engineering, Microwave Transmission +16

Heterogeneous Integration of Double Side SiP for IoT and 5G Application

Mike Tsai, Ryan Chiu, Ming-Fan Tsai et al. · 2021 · 10 citations