Kazuhisa Itoi

On-Chip High-$Q$Variable Inductor Using Wafer-Level Chip-Scale Package Technology

Kenichi Okada, Hirotaka Sugawara, Hiroyuki Ito et al. · IEEE Transactions on Electron Devices · 2006 · 34 citations

Engineering, Electrical Engineering, Actuators +16

Si through-hole interconnections filled with Au-Sn solder by molten metal suction method

Satoshi Yamamoto, Kazuhisa Itoi, Tatsuo Suemasu et al. · 2003 · 17 citations

Engineering, Electrical Engineering, Materials Science +16

On-chip high-Q spiral Cu inductors embedded in wafer-level chip-scale package for silicon RF application

Kazuhisa Itoi, Masakazu Sato, H. Abe et al. · 2004 · 17 citations

Engineering, Electrical Engineering, Microelectronics +16

Phase Diagrams in the Solid Solution Nd–Ba–Cu–O System and NdBa₂Cu₃O_7-δ Single Crystals Growth by the Traveling-Solvent Floating-Zone Method

Kiyoshi Kuroda, Kazuhisa Itoi, Jun‐ichi Okano et al. · Japanese Journal of Applied Physics · 1997 · 16 citations

Natural Sciences, Materials Science, Physics +17

Conductive interconnections through thick silicon substrates for 3D packaging

T Takizawa, Satoshi Yamamoto, Kazuhisa Itoi et al. · 2003 · 15 citations

Engineering, Materials Engineering, Materials Science +17