Analysis and design of inductive coupling and transceiver circuit for inductive inter-chip wireless superconnect

Noriyuki Miura, D. Mizoguchi, T. Sakurai, +1

IEEE Journal of Solid-State Circuits

Low-power ElectronicsElectrical EngineeringInductive CouplingEngineeringTransceiver Circuit Design +13

A 0.14pJ/b Inductive-Coupling Inter-Chip Data Transceiver with Digitally-Controlled Precise Pulse Shaping

Noriyuki Miura, Hiroki Ishikuro, Takayasu Sakurai, +1

EngineeringRadio FrequencyCommunication CircuitReceiver EnergyDigitally-controlled Precise Pulse +14

A 1.2Gb/s/pin wireless superconnect based on inductive inter-chip signaling (IIS)

D. Mizoguchi, Yusmeeraz Yusof, Noriyuki Miura, +2

Electrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Chip On BoardComputer Engineering +10

A 1Tb/s 3W inductive-coupling transceiver for inter-chip clock and data link

Noriyuki Miura, D. Mizoguchi, Maki Inoue, +6

Electrical EngineeringClock RateEngineeringRadio FrequencyHigh-frequency Device +13

A 1 Tb/s 3 W Inductive-Coupling Transceiver for 3D-Stacked Inter-Chip Clock and Data Link

Noriyuki Miura, D. Mizoguchi, Mari Inoue, +6

IEEE Journal of Solid-State Circuits

Wireless CommunicationsEngineeringRadio FrequencyMicrowave TransmissionComputer Architecture +17

A 195-Gb/s 1.2-W Inductive Inter-Chip Wireless Superconnect With Transmit Power Control Scheme for 3-D-Stacked System in a Package

Noriyuki Miura, D. Mizoguchi, Maki Inoue, +2

IEEE Journal of Solid-State Circuits

Low-power Electronics3D Ic ArchitectureElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors) +11

An 11Gb/s Inductive-Coupling Link with Burst Transmission

Noriyuki Miura, Yoshinori Kohama, Yasufumi Sugimori, +3

PhotonicsElectrical EngineeringEngineeringVlsi DesignInductive-coupling Link +13

A High-Speed Inductive-Coupling Link With Burst Transmission

Noriyuki Miura, Yoshinori Kohama, Yasfumi Sugimori, +3

IEEE Journal of Solid-State Circuits

Electrical EngineeringEngineeringVlsi DesignHigh-frequency DeviceNm Cmos +13

A 195Gb/s 1.2W 3D-stacked inductive inter-chip wireless superconnect with transmit power control scheme

Noriyuki Miura, D. Mizoguchi, Maki Inoue, +3

3D Ic ArchitectureElectrical EngineeringWireless Power TransmissionEngineeringAdvanced Packaging (Semiconductors) +11

Physical Attack Protection Techniques for IC Chip Level Hardware Security

Makoto Nagata, Takuji Miki, Noriyuki Miura

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Hardware TrojanEngineeringInformation SecurityComputer ArchitectureIntegrated Circuits +16