Concepedia

Dao-Sheng Chen

DC

5

Publications

165

Citations

5

H-Index

2009

Active since

Affiliations

National Chung Hsing University(Current)

Dao-Sheng Chen is an author at National Chung Hsing University specializing in engineering, applied physics, and materials science.

Top concepts

EngineeringApplied PhysicsMaterial ScienceThin FilmsNanomaterialsMicrostructureNanotechnologySurface ScienceMaterials EngineeringChemistry

Publications per year

2009–2010

5

Publications

5

10-nm-thick quinary (AlCrTaTiZr)N film as effective diffusion barrier for Cu interconnects at 900 °C

Shou-Yi Chang, Dao-Sheng Chen · Applied Physics Letters · 2009 · 64 citations

Materials Science, Diffusion Barrier Layer, Engineering +14

Multiprincipal-Element AlCrTaTiZr-Nitride Nanocomposite Film of Extremely High Thermal Stability as Diffusion Barrier for Cu Metallization

Shou-Yi Chang, Ming-Ku Chen, Dao-Sheng Chen · Journal of The Electrochemical Society · 2009 · 64 citations

High Thermal Stability, Engineering, Mechanical Engineering +18

(AlCrTaTiZr)N/(AlCrTaTiZr)N0.7 bilayer structure of high resistance to the interdiffusion of Cu and Si at 900 °C

Shou-Yi Chang, Dao-Sheng Chen · Materials Chemistry and Physics · 2010 · 15 citations

Materials Science, Surface Characterization, Material Analysis +9

Ultrathin (AlCrTaTiZr)N[sub x]/AlCrTaTiZr Bilayer Structures with High Diffusion Resistance for Cu Interconnects

Shou-Yi Chang, Dao-Sheng Chen · Journal of The Electrochemical Society · 2010 · 12 citations

Interface Adhesion, Engineering, Chemistry +18

Multiprincipal-Element AlCrTaTiZr-Nitride Nanocomposite Film of Extremely High Thermal Stability as Diffusion Barrier for Cu Metallization

Dao-Sheng Chen, Ming-Ku Chen, Shou-Yi Chang · ECS Transactions · 2009 · 10 citations

High Thermal Stability, Engineering, Mechanical Engineering +18

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