3
Publications
91
Citations
3
H-Index
1987
Active since
Affiliations
Hewlett-Packard (United States)(Current)
G. Harkins is an author at Hewlett-Packard (United States) specializing in mechanical engineering, electronic packaging, and engineering.
Top concepts
EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringMechanical EngineeringReliabilityHeat TransferAdvanced PackagingThermal EngineeringMechanics Of Materials
Publications per year
1987–2003
3
3
Thermal Fatigue Reliability of SMT Packages and Interconnections
John H. Lau, G. Harkins, D. Rice et al. · Reliability physics · 1987 · 27 citations
Engineering, Mechanical Engineering, Package Reliability +19
Thermal-stress analysis of SOIC packages and interconnections
John H. Lau, G. Harkins · 2003 · 25 citations
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