Shinya Konishi

Effect of Annealing Atmosphere on Void Formation in Copper Interconnects

Shinya Konishi, Miki Moriyama, Masanori Murakami · MATERIALS TRANSACTIONS · 2002 · 28 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Structural characterization of threading dislocation in α-Ga2O3 thin films on <i>c</i>- and <i>m</i>-plane sapphire substrates

Hitoshi Takane, Shinya Konishi, Yuichiro Hayasaka et al. · Journal of Applied Physics · 2024 · 17 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +16

Effect of Organic Additives on Formation and Growth Behavior of Micro-Void in Electroplating Copper Films

Miki Moriyama, Shinya Konishi, Susumu Tsukimoto et al. · MATERIALS TRANSACTIONS · 2004 · 16 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +16

Transmission electron microscopic study on rutile-type GeO2 film on TiO2 (001) substrate

Hitoshi Takane, Shinya Konishi, Ryo Ota et al. · Applied Physics Letters · 2024 · 15 citations

Natural Sciences, Materials Engineering, Materials Science +17

Magnetic and electrical properties of LuFe₂O₄ epitaxial thin films with a self-assembled interface structure

You Jin Kim, Shinya Konishi, Yuichiro Hayasaka et al. · CrystEngComm · 2019 · 13 citations

Natural Sciences, Materials Engineering, Materials Science +17