Concepedia

T. Ohsaki

TO

6

Publications

208

Citations

6

H-Index

1986

Active since

Affiliations

NTT (Japan)(Current)

T. Ohsaki is an author at NTT (Japan) specializing in electronic packaging, electrical engineering, and microelectronics.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringMicrofabricationIntegrated CircuitsComputer EngineeringAdvanced PackagingApplied PhysicsFlexible Electronics

Publications per year

1986–2002

6

Publications

6

VLSI Packaging Technique Using Liquid-Cooled Channels

T. Kishimoto, T. Ohsaki · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1986 · 74 citations

Engineering, Liquid Metal Cooling, New Packaging Technique +16

VLSI Chip Interconnection Technology Using Stacked Solder Bumps

Nobuyuki Matsui, S. Sasaki, T. Ohsaki · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1987 · 41 citations

Materials Engineering, Shear Strain, Electrical Engineering +15

Multichip 1.8-Gb/s high-speed space-division switching module using copper-polyimide multilayer substrate

Naoaki Yamanaka, S. Kikuchi, T. Kon et al. · 2002 · 30 citations

Electrical Engineering, Engineering, Vlsi Design +15

A new multichip module using a copper polyimide multilayer substrate

Shinya Sasaki, T. Kon, T. Ohsaki et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1989 · 25 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +16

Electronic packaging in the 1990s-a perspective from Asia

T. Ohsaki · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1991 · 22 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +21

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