Akira Yamauchi

Combined Surface Activated Bonding Technique for Low-Temperature Cu/Dielectric Hybrid Bonding

Ran He, Masahisa Fujino, Akira Yamauchi et al. · ECS Journal of Solid State Science and Technology · 2016 · 49 citations

Engineering, Vacuum Device, Interconnect (Integrated Circuits) +17

Cation-exchange properties of lipid films

Kimizuka Hideo, T. Nakahara, Uejo Hiromichi et al. · Biochimica et Biophysica Acta (BBA) - Lipids and Lipid Metabolism · 1967 · 42 citations

Interface Chemistry, Lipid Films, Lipid Movement +2

Synthesis of 2,2″-bis(diphenylphosphino)-1,1″-biferrocene, a planar chiral bisphosphine, and its palladium(<scp>II</scp>) complex

Masaya Sawamura, Akira Yamauchi, Toshiaki Takegawa et al. · Journal of the Chemical Society Chemical Communications · 1991 · 34 citations

Materials Science, Inorganic Chemistry, Inorganic Synthesis +8

Surface activated bonding for new flip chip and bumpless interconnect systems

Tadatomo Suga, Toshihiro Itoh, Zhonghua Xu et al. · 2003 · 34 citations

Engineering, Ultra-high Density, Interconnect (Integrated Circuits) +16

Sequential plasma activation methods for hydrophilic direct bonding at sub-200 °C

Ran He, Akira Yamauchi, Tadatomo Suga · Japanese Journal of Applied Physics · 2018 · 24 citations

Engineering, Glass Material, N2 Plasma +17