Zhao-Yun Wang

Electrochemical and in situ FTIR spectroscopic studies of gentian violet as a novel leveler in through-holes metallization for printed circuit board applications

Zhao-Yun Wang, Lei Jin, Guang Li et al. · Electrochimica Acta · 2022 · 52 citations

Materials Engineering, Materials Science, Novel Leveler +6

Novel, Simple, and Green Citrate-Based Copper Electronic Electroplating Bath in Microvia Void-Free Filling for Printed Circuit Board Application

Lei Jin, Weiqing Li, Zhao-Yun Wang et al. · ACS Sustainable Chemistry & Engineering · 2022 · 20 citations

Materials Science, Electrometallurgy, Chemical Engineering +15

1-(2-Pyridylazo)-2-naphthol as a synergistic additive for improving throwing power of through hole copper electronic electroplating

Lei Jin, Zhao-Yun Wang, Zhuan‐Yun Cai et al. · Journal of Industrial and Engineering Chemistry · 2023 · 16 citations · Full text

Advanced Ag nanoparticles for the catalyzation of glyoxylic acid oxidation in through-holes electroless copper metallization

An-Ni Zheng, Zhao-Yun Wang, Jiaqiang Yang et al. · Journal of Colloid and Interface Science · 2023 · 13 citations

Materials Science, Chemical Engineering, Engineering +9