Concepedia

Hideo Seno

HS

3

Publications

151

Citations

3

H-Index

1995

Active since

Affiliations

Lintec Corporation (Japan)(Current)

Hideo Seno is an author at Lintec Corporation (Japan) specializing in engineering, electronic packaging, and materials science.

Top concepts

EngineeringMaterial ScienceElectronic PackagingAdvanced PackagingMechanical Engineering3D PrintingFood PackagingApplied PhysicsPolymer ScienceDefect Tolerance

Publications per year

1995–2010

3

Publications

3

UV curable pressure‐sensitive adhesives for fabricating semiconductors. I. Development of easily peelable dicing tapes

Kazuyoshi Ebe, Hideo Seno, Katsuhiko Horigome · Journal of Applied Polymer Science · 2003 · 102 citations · Full text

Materials Science, Polymer Chemistry, Loose Adhesion +13

Study on Peeling Behavior in Pick-up Process of IC Chip with Adhesive Tapes

Naoya Saiki, Kazuaki Inaba, Kikuo KISHIMOTO et al. · Journal of Solid Mechanics and Materials Engineering · 2010 · 30 citations · Full text

Energy Release Rate, Engineering, Mechanical Engineering +17

Cracking failures in lead-on-chip packages induced by chip backside contamination

Masayuki Amagai, Hideo Seno, Kazuyoshi Ebe · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1995 · 19 citations

Advanced Packaging, Materials Science, Chip-scale Package +14

Rows per page

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