Hai‐Bao Chen - Concepedia

Author

Hai‐Bao Chen

Shanghai Jiao Tong University ORCID

Also Known As

CHEN HAIBAO, Chen Hai-Bao, Chen, Hai-Bao, Hai-Bao CHEN, Hai-Bao Chen, Hai-bao Chen, Haibao Chen, Hai‐Bao Chen

119

Publications

1.4K

Citations

H-Index

115

Concepts

All Affiliations

Shanghai Jiao Tong University University of California, Riverside Southern University of Science and Technology Mentor Technologies University of Hong Kong

About

Hai‐Bao Chen is an author at Shanghai Jiao Tong University specializing in engineering, computer engineering, and computer science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	19	31	1K
2	Medicine	4	4	60
3	Biochemistry	4	4	60
4	Natural Sciences	3	3	58
5	Social Sciences	2	2	36

Hai‐Bao Chen

Publications

1.2K

Citations

H-Index

Page 1

	Year	Citations
SVM Based Network Intrusion Detection for the UNSW-NB15 Dataset Dishan Jing, Hai‐Bao Chen Anomaly DetectionMachine LearningEngineeringBiometricsInformation Forensics	2019	124
Scale Adaptive Proposal Network for Object Detection in Remote Sensing Images Shuo Zhang, Guanghui He, Hai‐Bao Chen, IEEE Geoscience and Remote Sensing Letters Remote Sensing ImagesImage ClassificationConvolutional Neural NetworkMachine VisionImage Analysis	2019	109
Time Domain Model Order Reduction of General Orthogonal Polynomials for Linear Input-Output Systems Yao‐Lin Jiang, Hai‐Bao Chen IEEE Transactions on Automatic Control Spectral TheoryNumerical AnalysisReduced Order ModelingNonlinear System IdentificationEngineering	2011	82
Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees Hai‐Bao Chen, Sheldon X.-D. Tan, Xin Huang, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems Electrical EngineeringElectromigration TechniqueEngineeringAdvanced Packaging (Semiconductors)Physical Design (Electronics)	2016	70
Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs Zao Liu, Sahana Swarup, Sheldon X.-D. Tan, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems EngineeringThermal Issue3-D Stacked IcsIntegrated CircuitsInterconnect (Integrated Circuits)	2014	64
Design for reliability with the advanced integrated circuit (IC) technology: challenges and opportunities Zhigang Ji, Hai‐Bao Chen, Xiuyan Li Science China Information Sciences ReliabilityElectrical EngineeringReliability EngineeringEngineeringHardware Reliability	2019	46
Thermal-Sensor-Based Occupancy Detection for Smart Buildings Using Machine-Learning Methods Hengyang Zhao, Qi Hua, Hai‐Bao Chen, ACM Transactions on Design Automation of Electronic Systems High AccuracyEngineeringMachine LearningData ScienceUser Behavior Prediction	2018	42
Analytical Modeling of Electromigration Failure for VLSI Interconnect Tree Considering Temperature and Segment Length Effects Hai‐Bao Chen, Sheldon X.-D. Tan, Jiangtao Peng, IEEE Transactions on Device and Materials Reliability EngineeringStress EvolutionAnalytical ModelingInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2017	41
Application of General Orthogonal Polynomials to Fast Simulation of Nonlinear Descriptor Systems Through Piecewise-Linear Approximation Yao‐Lin Jiang, Hai‐Bao Chen IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems Numerical AnalysisEngineeringLinear SystemNonlinear FunctionNonlinear System Identification	2012	32
Electromigration recovery modeling and analysis under time-dependent current and temperature stressing Xin Huang, Valeriy Sukharev, Taeyoung Kim, EngineeringElectromigration Recovery ModelingEm ModelInterconnect (Integrated Circuits)Em Models	2016	29

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