Jikai Xu - Concepedia

Author

Jikai Xu

Harbin Institute of Technology ORCID

Also Known As

Jikai Xu, XU Jikai

Publications

762

Citations

H-Index

Concepts

All Affiliations

Harbin Institute of Technology The University of Tokyo National University of Singapore

About

Jikai Xu is an author at Harbin Institute of Technology specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	13	501
2	Applied Physics	11	11	372
3	Chemical Engineering	2	2	104
4	Electrical Engineering	2	2	78
5	Chemistry	1	1	84

Jikai Xu

Publications

673

Citations

H-Index

Page 1

	Year	Citations
Nanometer-Scale Heterogeneous Interfacial Sapphire Wafer Bonding for Enabling Plasmonic-Enhanced Nanofluidic Mid-Infrared Spectroscopy Jikai Xu, Zhihao Ren, Bowei Dong, ACS Nano	2020	92
Volatile organic compounds sensing based on Bennet doubler-inspired triboelectric nanogenerator and machine learning-assisted ion mobility analysis Jianxiong Zhu, Zhongda Sun, Jikai Xu, Science Bulletin Chemical EngineeringElectronic DevicesEngineeringElectronic MaterialsOrganic Electronics	2021	84
Mechanisms for low-temperature direct bonding of Si/Si and quartz/quartz <i>via</i> VUV/O<sub>3</sub> activation Jikai Xu, Chenxi Wang, Te Wang, RSC Advances	2018	70
Glass-on-LiNbO3 heterostructure formed via a two-step plasma activated low-temperature direct bonding method Jikai Xu, Chenxi Wang, Yanhong Tian, Applied Surface Science Materials ScienceGlass-ceramicEngineeringOptical GlassApplied Physics	2018	53
Progress in wafer bonding technology towards MEMS, high-power electronics, optoelectronics, and optofluidics Jikai Xu, Yu Du, Yanhong Tian, International Journal of Optomechatronics Optical MaterialsEngineeringDevice IntegrationOptoelectronic DevicesIntegrated Circuits	2020	52
Direct bonding of silicon and quartz glass using VUV/O3 activation and a multistep low-temperature annealing process Jikai Xu, Chenxi Wang, Te Wang, Applied Surface Science Materials EngineeringMaterials ScienceVuv/o3 ActivationGlass-ceramicEngineering	2018	47
Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes Ruyu Tian, Chunjin Hang, Yanhong Tian, Journal of Materials Processing Technology Materials ScienceMaterials EngineeringBrittle FractureEngineeringSuperalloy	2019	45
Fabrication of SiC/Si, SiC/SiO2, and SiC/glass heterostructures via VUV/O3 activated direct bonding at low temperature Jikai Xu, Chenxi Wang, Daoyuan Li, Ceramics International Materials EngineeringMaterials ScienceSemiconductor TechnologyEngineeringApplied Physics	2018	43
Single-crystalline SiC integrated onto Si-based substrates via plasma-activated direct bonding Qiushi Kang, Chenxi Wang, Fanfan Niu, Ceramics International Materials ScienceWafer Scale ProcessingEngineeringSingle-crystalline SicSurface Science	2020	37
A facile method for direct bonding of single-crystalline SiC to Si, SiO2, and glass using VUV irradiation Chenxi Wang, Jikai Xu, Shu Guo, Applied Surface Science Materials ScienceMaterials EngineeringEngineeringVuv IrradiationSingle-crystalline Sic	2018	31

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