F. Binder is an author at Siemens (Germany) specializing in electronic packaging, microelectronics, and engineering.
Top concepts
EngineeringMicroelectronicsElectronic PackagingApplied PhysicsMaterial ScienceElectrical InsulationMaterials EngineeringElectrical Engineering
Publications per year
1996–1997
2
2
Electromigration resistance of copper interconnects
D. Save, Flavie Braud, J. Torrès et al. · Microelectronic Engineering · 1997 · 39 citations
Electrical Engineering, Electromigration Technique, Engineering +7
Copper-based metallization for ULSI circuits
J. Torrès, J.L. Mermet, R. Madar et al. · Microelectronic Engineering · 1996 · 23 citations
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