Concepedia

Neil Gollhardt

NG

4

Publications

112

Citations

4

H-Index

1996

Active since

Affiliations

Rockwell Automation (United States)(Current)

Neil Gollhardt is an author at Rockwell Automation (United States) specializing in engineering, electronic packaging, and thermal engineering.

Top concepts

EngineeringThermal EngineeringElectronic PackagingHeat TransferRefrigerationMicrostructureMaterial ScienceThermal ModelingEnergy EfficiencyThermal Management

Publications per year

1996–2006

4

Publications

4

A STUDY OF FATIGUE AND CREEP BEHAVIOUR OF FOUR HIGH TEMPERATURE SOLDERS

Juan Liang, Neil Gollhardt, P. S. Lee et al. · Fatigue & Fracture of Engineering Materials & Structures · 1996 · 42 citations

Engineering, Mechanical Engineering, Cold Working +16

Junction Temperature Prediction of a Multiple-chip IGBT Module under DC Condition

Lixiang Wei, R.J. Kerkman, Richard A. Lukaszewski et al. · 2006 · 33 citations

Engineering, Energy Efficiency, Power Electronics +20

Heat transfer model for capacitor banks

Michael Gasperi, Neil Gollhardt · 2002 · 24 citations

Engineering, Liquid Metal Cooling, Energy Efficiency +17

Creep Study for Fatigue Life Assessment of Two Lead-Free High Temperature Solder Alloys

Jin Liang, P. S. Lee, Neil Gollhardt et al. · MRS Proceedings · 1996 · 13 citations

Materials Science, Engineering, High Temperature Materials +11

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