Concepedia

P. S. Lee

PS

7

Publications

182

Citations

7

H-Index

1990

Active since

Affiliations

Rockwell Automation (United States)(Current)

Marquette University

P. S. Lee is an author at Rockwell Automation (United States) specializing in engineering, mechanical engineering, and electronic packaging.

Top concepts

EngineeringMechanical EngineeringMaterial ScienceGeometry ModelingElectronic PackagingComputer-aided DesignStructural MechanicsMechanics Of MaterialsMicrostructureSolid Mechanics

Publications per year

1990–2011

7

Publications

7

Prediction of Solder Joint Geometries in Array-Type Interconnects

S. M. Heinrich, M. Schaefer, S. A. Schroeder et al. · Journal of Electronic Packaging · 1996 · 60 citations

Engineering, Mechanical Engineering, Computer-aided Design +18

Effect of Chip and Pad Geometry on Solder Joint Formation in SMT

S. M. Heinrich, Paul E. Liedtke, N. J. Nigro et al. · Journal of Electronic Packaging · 1993 · 39 citations

Engineering, Computer-aided Design, Contact Angles +20

Parametric Finite Element Method for Predicting Shapes of Three-Dimensional Solder Joints

N. J. Nigro, Fang Zhou, S. M. Heinrich et al. · Journal of Electronic Packaging · 1996 · 28 citations

Geometric Modeling, Finite Element Method, Numerical Analysis +15

Design of Double Composite Bridges using High Strength Steel

C H Chung, P. S. Lee · Procedia Engineering · 2011 · 16 citations · Full text

Bridge Design, Engineering, High Strength Steel +11

Solder Joint Formation in Surface Mount Technology—Part II: Design

S. M. Heinrich, N. J. Nigro, A. F. Elkouh et al. · Journal of Electronic Packaging · 1990 · 13 citations

Materials Science, Industrial Design, Geometric Modeling +15

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