Concepedia

Ping-Chen Chiang

PC

4

Publications

73

Citations

4

H-Index

2019

Active since

Affiliations

National Chung Hsing University(Current)

University of Hong Kong

Feng Chia University

Ping-Chen Chiang is an author at National Chung Hsing University specializing in materials science, engineering, and applied physics.

Top concepts

EngineeringMaterial ScienceApplied PhysicsSurface ScienceMaterials EngineeringMicrostructureElectrical EngineeringCorrosionThin FilmsElectrochemistry

Publications per year

2019–2021

4

Publications

4

Study of grain size effect of Cu metallization on interfacial microstructures of solder joints

Zeyang Zheng, Ping-Chen Chiang, Yu‐Ting Huang et al. · Microelectronics Reliability · 2019 · 28 citations

Materials Science, Friction Welding, Engineering +10

Electrodeposition of Twinned Cu with Strong Texture Effect on Voiding Propensity in Electroplated Cu Solder Joints

Ping-Chen Chiang, Yu-An Shen, Shien‐Ping Feng et al. · Journal of The Electrochemical Society · 2020 · 21 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Suppression of Void Formation at Sn/Cu Joint Due to Twin Formation in Cu Electrodeposit

Shan-Ting Tsai, Ping-Chen Chiang, Chang Liu et al. · JOM · 2019 · 12 citations

Materials Engineering, Materials Science, Electrical Engineering +11

Effects of impurities on void formation at the interface between Sn-3.0Ag-0.5Cu and Cu electroplated films

Ping-Chen Chiang, Yu-An Shen, Chih‐Ming Chen · Journal of Materials Science Materials in Electronics · 2021 · 12 citations

Materials Engineering, Materials Science, Electromigration Technique +8

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